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Taiwan’s TSMC raises $3.5 billion in bonds for unusual U.S. plant

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Economy2 hours ago (Apr 19, 2022 08: 21PM ET)

© Reuters. FILE PHOTO: The effect of Taiwan Semiconductor Manufacturing Co (TSMC) is pictured at its headquarters, in Hsinchu, Taiwan, January 19, 2021. REUTERS/Ann Wang

TAIPEI (Reuters) – Taiwanese chip agency TSMC has raised $3.5 billon in bonds for its unusual plant within the U.S. notify of Arizona, in accordance with a time-frame sheet.

Taiwan Semiconductor Manufacturing Co Ltd, a indispensable Apple Inc (NASDAQ: AAPL) seller and the sector’s most attention-grabbing contract chip-maker, started building supreme twelve months at the Arizona location the put it plans to spend $12 billion to make a computer chip manufacturing facility.

Taiwan’s TSMC raises $3.5 billion in bonds for unusual U.S. plant

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